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SURFACE MOUNT TECHNOLOGY
Enatel is able to offer single side, double side or mixed technology surface mount using the latest laser guided Juki placement machines and lead free reflow soldering processes.
These machines are capable of placing passive devices ranging from 0402 upwards to fine pitch QFPs, BGA’s and various other package types.
In addition to state of the art equipment we also possess some of the industries most highly skilled SMT operators.
If you require any further information on surface mount technology contact us today. |
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